Inventor
NISHIMURA ASAO
JP144 patents
⚠️ This page may combine multiple inventors who share the name “NISHIMURA ASAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
43 patentsUS6335565B1Jan 1, 2002
Semiconductor device
HITACHI LTD164 citations99
US5608265AMar 4, 1997
Encapsulated semiconductor device package having holes for electrically conductive material
HITACHI LTD567 citations99
US5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6627997B1Sep 30, 2003
Semiconductor module and method of mounting
HITACHI LTD124 citations98
US5571428ANov 5, 1996
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD113 citations98
US6798072B2Sep 28, 2004
Flip chip assembly structure for semiconductor device and method of assembling therefor
HITACHI LTD144 citations97
US6621154B1Sep 16, 2003
Semiconductor apparatus having stress cushioning layer
HITACHI LTD65 citations96
US6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6413850B1Jul 2, 2002
Method of forming bumps
HITACHI LTD102 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US6211576B1Apr 3, 2001
Semiconductor device
HITACHI LTD62 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5895965AApr 20, 1999
Semiconductor device
HITACHI LTD58 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5539250AJul 23, 1996
Plastic-molded-type semiconductor device
HITACHI LTD63 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5488254AJan 30, 1996
Plastic-molded-type semiconductor device
HITACHI LTD66 citations96
US5437915AAug 1, 1995
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD47 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5357139AOct 18, 1994
Plastic encapsulated semiconductor device and lead frame
HITACHI LTD58 citations96
US5347429ASep 13, 1994
Plastic-molded-type semiconductor device
HITACHI LTD86 citations96
US5299092AMar 29, 1994
Plastic sealed type semiconductor apparatus
HITACHI LTD80 citations96
US5159434AOct 27, 1992
Semiconductor device having a particular chip pad structure
HITACHI LTD68 citations96
US5041901AAug 20, 1991
Lead frame and semiconductor device using the same
HITACHI LTD82 citations96
US4942452AJul 17, 1990
Lead frame and semiconductor device
HITACHI LTD72 citations95
US6097100AAug 1, 2000
Resin sealed semiconductor devices and a process for manufacturing the same
HITACHI LTD56 citations94
US6784541B2Aug 31, 2004
Semiconductor module and mounting method for same
HITACHI LTD37 citations93
US6696765B2Feb 24, 2004
Multi-chip module
HITACHI LTD23 citations93
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6130112AOct 10, 2000
Semiconductor device
HITACHI LTD20 citations93
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6064112AMay 16, 2000
Resin-molded semiconductor device having a lead on chip structure
HITACHI LTD21 citations93
US6049128AApr 11, 2000
Semiconductor device
HITACHI LTD21 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US5635756AJun 3, 1997
Semiconductor device, lead frame therefor and memory card to provide a thin structure
HITACHI LTD18 citations93
US5391916AFeb 21, 1995
Resin sealed type semiconductor device
HITACHI LTD21 citations93
US5296737AMar 22, 1994
Semiconductor device with a plurality of face to face chips
HITACHI LTD34 citations93
RENESAS TECH CORP
7 patentsUS7138722B2Nov 21, 2006
Semiconductor device
RENESAS TECH CORP46 citations96
US6861742B2Mar 1, 2005
Wafer level chip size package having rerouting layers
RENESAS TECH CORP64 citations96
US6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US6831294B1Dec 14, 2004
Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes
RENESAS TECH CORP70 citations95
US6940162B2Sep 6, 2005
Semiconductor module and mounting method for same
RENESAS TECH CORP23 citations93
US6927489B1Aug 9, 2005
Semiconductor device provided with rewiring layer
RENESAS TECH CORP40 citations93
US6720591B2Apr 13, 2004
Semiconductor integrated circuit device
RENESAS TECH CORP16 citations93
Showing the top 50 of 144 patents by PatentIndex Score.