P

Inventor

YAGUCHI AKIHIRO

JP71 patents
⚠️ This page may combine multiple inventors who share the name “YAGUCHI AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

47 patents
US5608265AMar 4, 1997

Encapsulated semiconductor device package having holes for electrically conductive material

HITACHI LTD567 citations99
US5068712ANov 26, 1991

Semiconductor device

HITACHI LTD165 citations99
US5571428ANov 5, 1996

Semiconductor leadframe and its production method and plastic encapsulated semiconductor device

HITACHI LTD113 citations98
US5569960AOct 29, 1996

Electronic component, electronic component assembly and electronic component unit

HITACHI LTD105 citations98
US6621154B1Sep 16, 2003

Semiconductor apparatus having stress cushioning layer

HITACHI LTD65 citations96
US6081023AJun 27, 2000

Semiconductor device

HITACHI LTD28 citations96
US5895965AApr 20, 1999

Semiconductor device

HITACHI LTD58 citations96
US5793099AAug 11, 1998

Semiconductor device

HITACHI LTD30 citations96
US5612569AMar 18, 1997

Semiconductor device

HITACHI LTD35 citations96
US5539250AJul 23, 1996

Plastic-molded-type semiconductor device

HITACHI LTD63 citations96
US5530286AJun 25, 1996

Semiconductor device

HITACHI LTD53 citations96
US5437915AAug 1, 1995

Semiconductor leadframe and its production method and plastic encapsulated semiconductor device

HITACHI LTD47 citations96
US5358904AOct 25, 1994

Semiconductor device

HITACHI LTD47 citations96
US5357139AOct 18, 1994

Plastic encapsulated semiconductor device and lead frame

HITACHI LTD58 citations96
US5347429ASep 13, 1994

Plastic-molded-type semiconductor device

HITACHI LTD86 citations96
US5299092AMar 29, 1994

Plastic sealed type semiconductor apparatus

HITACHI LTD80 citations96
US5229643AJul 20, 1993

Semiconductor apparatus and semiconductor package

HITACHI LTD54 citations96
US5159434AOct 27, 1992

Semiconductor device having a particular chip pad structure

HITACHI LTD68 citations96
US5041901AAug 20, 1991

Lead frame and semiconductor device using the same

HITACHI LTD82 citations96
US4942452AJul 17, 1990

Lead frame and semiconductor device

HITACHI LTD72 citations95
US6696765B2Feb 24, 2004

Multi-chip module

HITACHI LTD23 citations93
US6130112AOct 10, 2000

Semiconductor device

HITACHI LTD20 citations93
US6130114AOct 10, 2000

Semiconductor device

HITACHI LTD17 citations93
US6100580AAug 8, 2000

Semiconductor device having all outer leads extending from one side of a resin member

HITACHI LTD17 citations93
US6049128AApr 11, 2000

Semiconductor device

HITACHI LTD21 citations93
US6018191AJan 25, 2000

Semiconductor device

HITACHI LTD18 citations93
US5296737AMar 22, 1994

Semiconductor device with a plurality of face to face chips

HITACHI LTD34 citations93
US5293068AMar 8, 1994

Semiconductor device

HITACHI LTD35 citations93
US5194935AMar 16, 1993

Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure

HITACHI LTD23 citations93
US5047837ASep 10, 1991

Semiconductor device with heat transfer cap

HITACHI LTD46 citations93
US6639315B2Oct 28, 2003

Semiconductor device and mounted semiconductor device structure

HITACHI LTD42 citations92
US6512176B2Jan 28, 2003

Semiconductor device

HITACHI LTD23 citations92
US6465876B1Oct 15, 2002

Semiconductor device and lead frame therefor

HITACHI LTD16 citations92
US6348741B1Feb 19, 2002

Semiconductor apparatus and a manufacturing method thereof

HITACHI LTD25 citations92
US6340793B1Jan 22, 2002

Semiconductor device

HITACHI LTD37 citations92
US5637914AJun 10, 1997

Lead frame and semiconductor device encapsulated by resin

HITACHI LTD24 citations92
US5101263AMar 31, 1992

Semiconductor device and method for manufacturing the same

HITACHI LTD27 citations92
US4987474AJan 22, 1991

Semiconductor device and method of manufacturing the same

HITACHI LTD41 citations92
USRE37690EMay 7, 2002

Lead frame and semiconductor device

HITACHI LTD25 citations91
US5295045AMar 15, 1994

Plastic-molded-type semiconductor device and producing method therefor

HITACHI LTD23 citations91
US6452256B1Sep 17, 2002

Semiconductor device

HITACHI LTD18 citations84
US6326681B1Dec 4, 2001

Semiconductor device

HITACHI LTD14 citations82
US6303982B2Oct 16, 2001

Semiconductor device

HITACHI LTD10 citations82
US6072231AJun 6, 2000

Semiconductor device

HITACHI LTD12 citations82
US6069029AMay 30, 2000

Semiconductor device chip on lead and lead on chip manufacturing

HITACHI LTD13 citations82
US5981315ANov 9, 1999

Semiconductor device

HITACHI LTD7 citations82
US5914530AJun 22, 1999

Semiconductor device

HITACHI LTD15 citations82

YAGUCHI AKIHIRO

1 patent

RENESAS TECH CORP

1 patent

TANAKA KOTARO

1 patent

Showing the top 50 of 71 patents by PatentIndex Score.