Inventor
YONEDA NAE
JP13 patents
⚠️ This page may combine multiple inventors who share the name “YONEDA NAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
11 patentsUS5608265AMar 4, 1997
Encapsulated semiconductor device package having holes for electrically conductive material
HITACHI LTD567 citations99
US5569960AOct 29, 1996
Electronic component, electronic component assembly and electronic component unit
HITACHI LTD105 citations98
US5914531AJun 22, 1999
Semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD68 citations96
US5539250AJul 23, 1996
Plastic-molded-type semiconductor device
HITACHI LTD63 citations96
US5357139AOct 18, 1994
Plastic encapsulated semiconductor device and lead frame
HITACHI LTD58 citations96
US5347429ASep 13, 1994
Plastic-molded-type semiconductor device
HITACHI LTD86 citations96
US5296737AMar 22, 1994
Semiconductor device with a plurality of face to face chips
HITACHI LTD34 citations93
US5194935AMar 16, 1993
Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure
HITACHI LTD23 citations93
US6114192ASep 5, 2000
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD39 citations92
US5295045AMar 15, 1994
Plastic-molded-type semiconductor device and producing method therefor
HITACHI LTD23 citations91
US5256903AOct 26, 1993
Plastic encapsulated semiconductor device
HITACHI LTD7 citations73