Inventor
ANJOH ICHIRO
JP69 patents
⚠️ This page may combine multiple inventors who share the name “ANJOH ICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
44 patentsUS5571428ANov 5, 1996
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD113 citations98
US5569960AOct 29, 1996
Electronic component, electronic component assembly and electronic component unit
HITACHI LTD105 citations98
US5332922AJul 26, 1994
Multi-chip semiconductor package
HITACHI LTD158 citations98
US6114005ASep 5, 2000
Laminate and multilayer printed circuit board
HITACHI LTD98 citations97
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5914531AJun 22, 1999
Semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD68 citations96
US5895965AApr 20, 1999
Semiconductor device
HITACHI LTD58 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5677045AOct 14, 1997
Laminate and multilayer printed circuit board
HITACHI LTD86 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5442233AAug 15, 1995
Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation
HITACHI LTD55 citations96
US5437915AAug 1, 1995
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD47 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5357139AOct 18, 1994
Plastic encapsulated semiconductor device and lead frame
HITACHI LTD58 citations96
US5299092AMar 29, 1994
Plastic sealed type semiconductor apparatus
HITACHI LTD80 citations96
US6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US5701031ADec 23, 1997
Sealed stacked arrangement of semiconductor devices
HITACHI LTD58 citations95
US5371044ADec 6, 1994
Method of uniformly encapsulating a semiconductor device in resin
HITACHI LTD60 citations95
US5466888ANov 14, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD72 citations94
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6130112AOct 10, 2000
Semiconductor device
HITACHI LTD20 citations93
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6049128AApr 11, 2000
Semiconductor device
HITACHI LTD21 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US5296737AMar 22, 1994
Semiconductor device with a plurality of face to face chips
HITACHI LTD34 citations93
US6465876B1Oct 15, 2002
Semiconductor device and lead frame therefor
HITACHI LTD16 citations92
US6433440B1Aug 13, 2002
Semiconductor device having a porous buffer layer for semiconductor device
HITACHI LTD24 citations92
US6396145B1May 28, 2002
Semiconductor device and method for manufacturing the same technical field
HITACHI LTD38 citations92
US6114192ASep 5, 2000
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
HITACHI LTD39 citations92
US5585665ADec 17, 1996
Packaged semiconductor device and a leadframe therefor
HITACHI LTD31 citations92
US5406028AApr 11, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD24 citations91
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
RENESAS TECH CORP
5 patentsUS6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US7420284B2Sep 2, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP39 citations92
US6888230B1May 3, 2005
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
RENESAS TECH CORP16 citations92
US6710446B2Mar 23, 2004
Semiconductor device comprising stress relaxation layers and method for manufacturing the same
RENESAS TECH CORP44 citations92
US6664135B2Dec 16, 2003
Method of manufacturing a ball grid array type semiconductor package
RENESAS TECH CORP7 citations74
AKITA ELECTRONICS SYSTEMS CO L
1 patentShowing the top 50 of 69 patents by PatentIndex Score.