Inventor
MURAKAMI GEN
JP81 patents
⚠️ This page may combine multiple inventors who share the name “MURAKAMI GEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
39 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US4707724ANov 17, 1987
Semiconductor device and method of manufacturing thereof
HITACHI LTD352 citations99
US5332922AJul 26, 1994
Multi-chip semiconductor package
HITACHI LTD158 citations98
US5184208AFeb 2, 1993
Semiconductor device
HITACHI LTD115 citations98
US4301464ANov 17, 1981
Lead frame and semiconductor device employing the same with improved arrangement of supporting leads for securing the semiconductor supporting member
HITACHI LTD228 citations98
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US5095626AMar 17, 1992
Method of producing semiconductor memory packages
HITACHI LTD84 citations97
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5442233AAug 15, 1995
Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation
HITACHI LTD55 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5357139AOct 18, 1994
Plastic encapsulated semiconductor device and lead frame
HITACHI LTD58 citations96
US5295297AMar 22, 1994
Method of producing semiconductor memory
HITACHI LTD75 citations96
US4994411AFeb 19, 1991
Process of producing semiconductor device
HITACHI LTD87 citations96
US4971196ANov 20, 1990
Surface package type semiconductor package
HITACHI LTD66 citations96
US4951122AAug 21, 1990
Resin-encapsulated semiconductor device
HITACHI LTD54 citations96
US5701031ADec 23, 1997
Sealed stacked arrangement of semiconductor devices
HITACHI LTD58 citations95
US4989068AJan 29, 1991
Semiconductor device and method of manufacturing the same
HITACHI LTD57 citations95
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US5296737AMar 22, 1994
Semiconductor device with a plurality of face to face chips
HITACHI LTD34 citations93
US5194935AMar 16, 1993
Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure
HITACHI LTD23 citations93
US5150193ASep 22, 1992
Resin-encapsulated semiconductor device having a particular mounting structure
HITACHI LTD107 citations93
US4706105ANov 10, 1987
Semiconductor device and method of producing the same
HITACHI LTD28 citations93
US5585665ADec 17, 1996
Packaged semiconductor device and a leadframe therefor
HITACHI LTD31 citations92
US5032895AJul 16, 1991
Semiconductor device and method of producing the same
HITACHI LTD37 citations92
US4987474AJan 22, 1991
Semiconductor device and method of manufacturing the same
HITACHI LTD41 citations92
US5235207AAug 10, 1993
Semiconductor device
HITACHI LTD43 citations89
US4691225ASep 1, 1987
Semiconductor device and a method of producing the same
HITACHI LTD46 citations89
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
HITACHI CABLE
9 patentsUS6002167ADec 14, 1999
Semiconductor device having lead on chip structure
HITACHI CABLE162 citations97
US6426548B1Jul 30, 2002
Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same
HITACHI CABLE47 citations96
US7317181B2Jan 8, 2008
Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit
HITACHI CABLE47 citations94
US6031292AFeb 29, 2000
Semiconductor device, interposer for semiconductor device
HITACHI CABLE66 citations94
US6433409B2Aug 13, 2002
Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same
HITACHI CABLE26 citations93
US6297142B1Oct 2, 2001
Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy
HITACHI CABLE26 citations93
US6114751ASep 5, 2000
Semiconductor device and electronic device
HITACHI CABLE62 citations93
US5866948AFeb 2, 1999
Interposer for semiconductor device
HITACHI CABLE31 citations91
US6855893B2Feb 15, 2005
Wiring board, semiconductor device, electronic device, and circuit board for electronic parts
HITACHI CABLE39 citations89
STANLEY ELECTRIC CO LTD
1 patentRENESAS TECH CORP
1 patentShowing the top 50 of 81 patents by PatentIndex Score.