Inventor · disambiguated record
Brian D. Chapman
Also filed as: CHAPMAN BRIAN · CHAPMAN BRIAN D
12 granted patents·2 pending applications·312 citations·filing 1990–2008
93Inventor score
Top patents by PatentIndex Score
14 records- 0190US5079456ACurrent monitoring and/or regulation for sense FET'sMOTOROLA INC·Filed 1990·Granted Jan 7, 1992·69 cites·11 claims
- 0279US7472818B2Selective rework process and apparatus for surface mount componentsIBM·Filed 2006·Granted Jan 6, 2009·7 cites·9 claims
- 0376US5872400AHigh melting point solder ball coated with a low melting point solderIBM·Filed 1997·Granted Feb 16, 1999·54 cites·10 claims
- 0471US6050481AMethod of making a high melting point solder ball coated with a low melting point solderIBM·Filed 1997·Granted Apr 18, 2000·34 cites·22 claims
- 0571US6028373APower supply distributed load startup systemMOTOROLA INC·Filed 1993·Granted Feb 22, 2000·38 cites·4 claims
- 0670US5138516AFault sensing and driving system for output driver deviceMOTOROLA INC·Filed 1990·Granted Aug 11, 1992·24 cites·10 claims
- 0766US5084668ASystem for sensing and/or controlling the level of current in a transistorMOTOROLA INC·Filed 1990·Granted Jan 28, 1992·24 cites·13 claims
- 0865US6511347B2Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board siteIBM·Filed 2001·Granted Jan 28, 2003·13 cites·9 claims
- 0957US6974071B2Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic componentsIBM·Filed 2003·Granted Dec 13, 2005·8 cites·14 claims
- 1056US7575146B2Selective rework apparatus for surface mount componentsIBM·Filed 2008·Granted Aug 18, 2009·1 cites·9 claims
- 1156US6059172AMethod for establishing electrical communication between a first object having a solder ball and a second objectIBM·Filed 1997·Granted May 9, 2000·23 cites·7 claims
- 1253US5111353AOvervoltage protection circuitMOTOROLA INC·Filed 1990·Granted May 5, 1992·17 cites·28 claims
- 1338US2006163330A1Site flattening tool and method for circuit board repairIBM·Filed 2005·Application pending·0 cites
- 1435US2006202001A1Enhanced heat system for bga/cga reworkIBM·Filed 2005·Application pending·0 cites
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