Inventor
MA WAI MON
US14 patents
⚠️ This page may combine multiple inventors who share the name “MA WAI MON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS7199309B2Apr 3, 2007
Structure for repairing or modifying surface connections on circuit boards
IBM19 citations91
US6912780B2Jul 5, 2005
Method and structure for repairing or modifying surface connections on circuit boards
IBM14 citations91
US6784377B2Aug 31, 2004
Method and structure for repairing or modifying surface connections on circuit boards
IBM25 citations91
US6182884B1Feb 6, 2001
Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards
IBM28 citations91
US6059172AMay 9, 2000
Method for establishing electrical communication between a first object having a solder ball and a second object
IBM23 citations91
US6050481AApr 18, 2000
Method of making a high melting point solder ball coated with a low melting point solder
IBM34 citations91
US5909011AJun 1, 1999
Method and apparatus for modifying circuit having ball grid array interconnections
IBM22 citations91
US5890284AApr 6, 1999
Method for modifying circuit having ball grid array interconnections
IBM21 citations91
US5872400AFeb 16, 1999
High melting point solder ball coated with a low melting point solder
IBM54 citations91
US6511347B2Jan 28, 2003
Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site
IBM13 citations83
US6974071B2Dec 13, 2005
Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
IBM8 citations69
US7841078B2Nov 30, 2010
Method of optimizing land grid array geometry
IBM6 citations58
US6016947AJan 25, 2000
Non-destructive low melt test for off-composition solder
IBM6 citations57