Inventor
MACQUARRIE STEPHEN WESLEY
US5 patents
Patents
5 patentsUS5969947AOct 19, 1999
Integral design features for heatsink attach for electronic packages
IBM48 citations94
US6373703B2Apr 16, 2002
Integral design features for heatsink attach for electronic packages
IBM38 citations90
US5872397AFeb 16, 1999
Semiconductor device package including a thick integrated circuit chip stack
IBM20 citations89
US6150716ANov 21, 2000
Metal substrate having an IC chip and carrier mounting
IBM30 citations88
US6107121AAug 22, 2000
Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package
IBM8 citations71