Inventor
DOWNES GARY C
US15 patents
⚠️ This page may combine multiple inventors who share the name “DOWNES GARY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TECHNIC
14 patentsUS6197182B1Mar 6, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC110 citations98
US6251238B1Jun 26, 2001
Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistance
TECHNIC76 citations96
US6296753B1Oct 2, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC17 citations92
US6524463B2Feb 25, 2003
Method of processing wafers and other planar articles within a processing cell
TECHNIC30 citations91
US6299751B1Oct 9, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC11 citations81
US6287443B1Sep 11, 2001
Apparatus and method for electroplating wafers, substrates and other articles
TECHNIC2 citations73
US6277260B1Aug 21, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC4 citations73
US6274024B1Aug 14, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC5 citations73
US6274023B1Aug 14, 2001
Apparatus and method for electroplating wafers, substrates and other articles
TECHNIC3 citations73
US6558750B2May 6, 2003
Method of processing and plating planar articles
TECHNIC12 citations72
US6419805B1Jul 16, 2002
Apparatus for plating wafers, substrates and other articles
TECHNIC1 citations62
US6267862B1Jul 31, 2001
Apparatus and method for plating wafers, substrates and other articles
TECHNIC1 citations62
US6361669B1Mar 26, 2002
Apparatus and method for plating wafers, substrates and other articles
TECHNIC0 citations51
US6322313B1Nov 27, 2001
Apparatus and method for inserting a wafer, substrate or other article into a process module
TECHNIC1 citations51