P

Inventor

JUE DARREN S

US30 patents
⚠️ This page may combine multiple inventors who share the name “JUE DARREN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

26 patents
US9626321B2Apr 18, 2017

High performance interconnect

INTEL CORP14 citations92
US9418035B2Aug 16, 2016

High performance interconnect physical layer

INTEL CORP9 citations92
US9378171B2Jun 28, 2016

High performance interconnect physical layer

INTEL CORP6 citations92
US9355058B2May 31, 2016

High performance interconnect physical layer

INTEL CORP13 citations92
US12197357B2Jan 14, 2025

High performance interconnect

INTEL CORP2 citations85
US10380046B2Aug 13, 2019

High performance interconnect physical layer

INTEL CORP4 citations84
US10216674B2Feb 26, 2019

High performance interconnect physical layer

INTEL CORP7 citations84
US9916266B2Mar 13, 2018

High performance interconnect physical layer

INTEL CORP4 citations84
US9600431B2Mar 21, 2017

High performance interconnect physical layer

INTEL CORP8 citations84
US9183171B2Nov 10, 2015

Fast deskew when exiting low-power partial-width high speed link state

INTEL CORP9 citations84
US11741030B2Aug 29, 2023

High performance interconnect

INTEL CORP2 citations83
US10248591B2Apr 2, 2019

High performance interconnect

INTEL CORP5 citations83
US9612986B2Apr 4, 2017

High performance interconnect physical layer

INTEL CORP6 citations82
US11080212B2Aug 3, 2021

High performance interconnect physical layer

INTEL CORP1 citations73
US10909055B2Feb 2, 2021

High performance interconnect physical layer

INTEL CORP0 citations73
US10387339B2Aug 20, 2019

High performance interconnect physical layer

INTEL CORP3 citations73
US10002095B2Jun 19, 2018

High performance interconnect physical layer

INTEL CORP2 citations73
US12189550B2Jan 7, 2025

High performance interconnect

INTEL CORP0 citations72
US11269793B2Mar 8, 2022

High performance interconnect

INTEL CORP0 citations72
US10216661B2Feb 26, 2019

High performance interconnect physical layer

INTEL CORP0 citations63
US10146733B2Dec 4, 2018

High performance interconnect physical layer

INTEL CORP1 citations63
US9892086B2Feb 13, 2018

High performance interconnect physical layer

INTEL CORP1 citations63
US9280507B2Mar 8, 2016

High performance interconnect physical layer

INTEL CORP2 citations63
US9208121B2Dec 8, 2015

High performance interconnect physical layer

INTEL CORP2 citations63
US10606774B2Mar 31, 2020

High performance interconnect physical layer

INTEL CORP0 citations52
US9697158B2Jul 4, 2017

High performance interconnect physical layer

INTEL CORP0 citations52

IYER VENKATRAMAN

2 patents

HEWLETT PACKARD DEVELOPMENT CO

1 patent

HEWLETT PACKARD CO

1 patent