Inventor

BOLOWSKI DANIEL

DE3 patents

Patents

3 patents

US8981553B2Mar 17, 2015

Power semiconductor module with integrated thick-film printed circuit board

INFINEON TECHNOLOGIES AG2 citations54

US11410950B2Aug 9, 2022

Semiconductor substrate having a bond pad material based on aluminum

INFINEON TECHNOLOGIES AG0 citations53

US9925588B2Mar 27, 2018

Semiconductor module bonding wire connection method

INFINEON TECHNOLOGIES AG0 citations27