P

Inventor

WONG WAI KEONG

MY11 patents
⚠️ This page may combine multiple inventors who share the name “WONG WAI KEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG WAI KEONG

4 patents
US8643159B2Feb 4, 2014

Lead frame with grooved lead finger

WONG WAI KEONG7 citations77
US9099363B1Aug 4, 2015

Substrate with corner cut-outs and semiconductor device assembled therewith

WONG WAI KEONG4 citations59
US9006874B2Apr 14, 2015

Lead frame with grooved lead finger

WONG WAI KEONG0 citations45
US9293395B2Mar 22, 2016

Lead frame with mold lock structure

WONG WAI KEONG0 citations36

FREESCALE SEMICONDUCTOR INC

2 patents
US7956471B2Jun 7, 2011

Mold and substrate for use with mold

FREESCALE SEMICONDUCTOR INC4 citations61
US8016183B2Sep 13, 2011

Adjustable clamp system and method for wire bonding die assembly

FREESCALE SEMICONDUCTOR INC3 citations53

EU POH LENG

1 patent
US8198143B2Jun 12, 2012

Mold and substrate for use with mold

EU POH LENG3 citations59

LEE BENG SIONG

1 patent
US8519519B2Aug 27, 2013

Semiconductor device having die pads isolated from interconnect portion and method of assembling same

LEE BENG SIONG3 citations46

CHEE SOO CHOONG

1 patent
US9165869B1Oct 20, 2015

Semiconductor device with twisted leads

CHEE SOO CHOONG0 citations42

CHAN SOON KANG

1 patent
US9190339B2Nov 17, 2015

Method of limiting capillary action of gel material during assembly of pressure sensor

CHAN SOON KANG1 citations39

CHEN SHOUHUI

1 patent
US9595505B2Mar 14, 2017

Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof

CHEN SHOUHUI1 citations35