Inventor
SEKITO YOSHIHIDE
JP18 patents
⚠️ This page may combine multiple inventors who share the name “SEKITO YOSHIHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KANEKA CORP
6 patentsUS10292262B2May 14, 2019
Reinforcing-plate-integrated flexible printed circuit board
KANEKA CORP1 citations60
US9957390B2May 1, 2018
Resin composition for pigment-containing insulating film, and use thereof
KANEKA CORP0 citations51
US9332653B2May 3, 2016
Resin composition for insulating film, and use thereof
KANEKA CORP0 citations51
US10045433B2Aug 7, 2018
Conductive-layer-integrated flexible printed circuit board
KANEKA CORP0 citations50
US10030133B2Jul 24, 2018
Black photosensitive resin composition and use of same
KANEKA CORP0 citations50
US9723708B2Aug 1, 2017
Conductive-layer-integrated flexible printed circuit board
KANEKA CORP0 citations50
SEKITO YOSHIHIDE
5 patentsUS8993897B2Mar 31, 2015
Photosensitive resin composition and use thereof
SEKITO YOSHIHIDE6 citations70
US9835942B2Dec 5, 2017
Photosensitive resin composition and use thereof
SEKITO YOSHIHIDE2 citations69
US8883894B2Nov 11, 2014
Insulating film and printed wiring board provided with insulating film
SEKITO YOSHIHIDE1 citations49
US8729402B2May 20, 2014
Polyimide precursor composition, use of the of the same, and production method of the same
SEKITO YOSHIHIDE0 citations49
US9458279B2Oct 4, 2016
Resin composition and use thereof
SEKITO YOSHIHIDE0 citations39
KIDO MASAYOSHI
4 patentsUS9072177B2Jun 30, 2015
Conductive layer integrated FPC
KIDO MASAYOSHI2 citations59
US8828525B2Sep 9, 2014
Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plate
KIDO MASAYOSHI2 citations58
US9237645B2Jan 12, 2016
Flexible printed circuit integrated with conductive layer
KIDO MASAYOSHI1 citations48
US9204528B2Dec 1, 2015
Flexible printed circuit integrated with stiffener
KIDO MASAYOSHI0 citations48