Inventor
VAIDYA ADITYA S
US5 patents
Patents
5 patentsUS11049798B2Jun 29, 2021
Embedded bridge with through-silicon Vias
INTEL CORP4 citations82
US10373893B2Aug 6, 2019
Embedded bridge with through-silicon vias
INTEL CORP9 citations82
US10672626B2Jun 2, 2020
Method and materials for warpage thermal and interconnect solutions
INTEL CORP1 citations62
US12159813B2Dec 3, 2024
Embedded bridge die with through-silicon vias
INTEL CORP0 citations61
US11587851B2Feb 21, 2023
Embedded bridge with through-silicon vias
INTEL CORP0 citations61