Inventor
START PAUL R
US10 patents
⚠️ This page may combine multiple inventors who share the name “START PAUL R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS11049798B2Jun 29, 2021
Embedded bridge with through-silicon Vias
INTEL CORP4 citations82
US10373893B2Aug 6, 2019
Embedded bridge with through-silicon vias
INTEL CORP9 citations82
US9461014B2Oct 4, 2016
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
INTEL CORP2 citations62
US12159813B2Dec 3, 2024
Embedded bridge die with through-silicon vias
INTEL CORP0 citations61
US11587851B2Feb 21, 2023
Embedded bridge with through-silicon vias
INTEL CORP0 citations61
US8866290B2Oct 21, 2014
Molded heat spreaders
INTEL CORP2 citations61
US11804470B2Oct 31, 2023
Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control
INTEL CORP0 citations58
US9064971B2Jun 23, 2015
Methods of forming ultra thin package structures including low temperature solder and structures formed therby
INTEL CORP1 citations51