P

Inventor

BANDOH KAZUHIKO

JP4 patents
⚠️ This page may combine multiple inventors who share the name “BANDOH KAZUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOWA CORP

3 patents
US6007316ADec 28, 1999

Apparatus for molding resin to seal electronic parts

TOWA CORP10 citations69
US5750059AMay 12, 1998

Method of molding resin to seal electronic parts

TOWA CORP15 citations69
US6594889B1Jul 22, 2003

Method for processing leadframe

TOWA CORP2 citations57

JAPAN FINE CERAMICS CT

1 patent
US7287975B2Oct 30, 2007

Resin mold material and resin mold

JAPAN FINE CERAMICS CT5 citations60