Inventor
AMAKAWA TSUYOSHI
JP3 patents
Patents
3 patentsUS9728426B2Aug 8, 2017
Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
TOWA CORP2 citations67
US6594889B1Jul 22, 2003
Method for processing leadframe
TOWA CORP2 citations57
US9580827B2Feb 28, 2017
Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member
TOWA CORP1 citations46