P

Inventor

YU YUET-YING

US28 patents
⚠️ This page may combine multiple inventors who share the name “YU YUET-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

20 patents
US6404211B2Jun 11, 2002

Metal buckling beam probe

IBM41 citations92
US5821759AOct 13, 1998

Method and apparatus for detecting shorts in a multi-layer electronic package

IBM44 citations92
US6504388B2Jan 7, 2003

Electrical test tool having easily replaceable electrical probe

IBM20 citations91
US6127832AOct 3, 2000

Electrical test tool having easily replaceable electrical probe

IBM30 citations91
US7118385B1Oct 10, 2006

Apparatus for implementing a self-centering land grid array socket

IBM29 citations90
US6529021B1Mar 4, 2003

Self-scrub buckling beam probe

IBM54 citations88
US6627052B2Sep 30, 2003

Electroplating apparatus with vertical electrical contact

IBM37 citations85
US6281692B1Aug 28, 2001

Interposer for maintaining temporary contact between a substrate and a test bed

IBM15 citations82
US11800666B2Oct 24, 2023

Temporary removable module lid

IBM4 citations74
US6252414B1Jun 26, 2001

Method and apparatus for testing circuits having different configurations with a single test fixture

IBM13 citations73
US10756009B1Aug 25, 2020

Efficient placement of grid array components

IBM5 citations72
US5900316AMay 4, 1999

Flexible conductive sheet

IBM3 citations63
US12439542B2Oct 7, 2025

Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

IBM0 citations62
US12028997B2Jul 2, 2024

Rotating lid for module cooler

IBM0 citations62
US6429672B2Aug 6, 2002

Contamination-tolerant electrical test probe

IBM3 citations60
US5898311AApr 27, 1999

Shorting pad having a flexible conductive sheet

IBM4 citations51
US10109975B2Oct 23, 2018

Module placement apparatus

IBM1 citations49
US10834860B2Nov 10, 2020

Method of mounting a module to a land grid array (LGA)

IBM0 citations46
US10537050B2Jan 14, 2020

Module installation alignment device

IBM0 citations46
US6984997B2Jan 10, 2006

Method and system for testing multi-chip integrated circuit modules

IBM0 citations36

GEN ELECTRIC

7 patents

BEAMAN BRIAN S

1 patent