Inventor
AWAD ELIE
US12 patents
⚠️ This page may combine multiple inventors who share the name “AWAD ELIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6815806B1Nov 9, 2004
Asymmetric partially-etched leads for finer pitch semiconductor chip package
IBM21 citations89
US7498673B2Mar 3, 2009
Heatplates for heatsink attachment for semiconductor chips
IBM21 citations88
US6894382B1May 17, 2005
Optimized electronic package
IBM16 citations83
US7834444B2Nov 16, 2010
Heatplates for heatsink attachment for semiconductor chips
IBM7 citations69
US7666712B2Feb 23, 2010
Design of BEOL patterns to reduce the stresses on structures below chip bondpads
IBM3 citations60
US7595681B2Sep 29, 2009
Method and apparatus for compensating for variances of a buried resistor in an integrated circuit
IBM4 citations60
US7489038B2Feb 10, 2009
Design of BEOL patterns to reduce the stresses on structures below chip bondpads
IBM1 citations60
US7071559B2Jul 4, 2006
Design of beol patterns to reduce the stresses on structures below chip bondpads
IBM3 citations60
US7251872B2Aug 7, 2007
Method for forming a chip package
IBM3 citations59
US7962322B2Jun 14, 2011
Design structure for compensating for variances of a buried resistor in an integrated circuit
IBM1 citations50
US7886237B2Feb 8, 2011
Method of generating a functional design structure
IBM0 citations40