Inventor
AWAD MARIETTE A
US3 patents
Patents
3 patentsUS7666712B2Feb 23, 2010
Design of BEOL patterns to reduce the stresses on structures below chip bondpads
IBM3 citations60
US7489038B2Feb 10, 2009
Design of BEOL patterns to reduce the stresses on structures below chip bondpads
IBM1 citations60
US7071559B2Jul 4, 2006
Design of beol patterns to reduce the stresses on structures below chip bondpads
IBM3 citations60