Inventor
BERNHARDT MICHAEL J
US17 patents
⚠️ This page may combine multiple inventors who share the name “BERNHARDT MICHAEL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
10 patentsUS9842976B2Dec 12, 2017
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
MICRON TECHNOLOGY INC3 citations83
US9455386B2Sep 27, 2016
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
MICRON TECHNOLOGY INC5 citations83
US11742458B2Aug 29, 2023
Textured optoelectronic devices and associated methods of manufacture
MICRON TECHNOLOGY INC2 citations72
US11411139B2Aug 9, 2022
Textured optoelectronic devices and associated methods of manufacture
MICRON TECHNOLOGY INC1 citations72
US11211537B2Dec 28, 2021
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
MICRON TECHNOLOGY INC2 citations72
US10756236B2Aug 25, 2020
Textured optoelectronic devices and associated methods of manufacture
MICRON TECHNOLOGY INC2 citations72
US10644211B2May 5, 2020
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
MICRON TECHNOLOGY INC1 citations72
US10084114B2Sep 25, 2018
Textured optoelectronic devices and associated methods of manufacture
MICRON TECHNOLOGY INC2 citations72
US12170348B2Dec 17, 2024
Vertical light emitting devices with nickel silicide bonding and methods of manufacturing
MICRON TECHNOLOGY INC0 citations62
US12283644B2Apr 22, 2025
Textured optoelectronic devices and associated methods of manufacture
MICRON TECHNOLOGY INC0 citations61
INTEL CORP
5 patentsUS10629652B2Apr 21, 2020
Dual-layer dielectric in memory device
INTEL CORP5 citations82
US9704923B1Jul 11, 2017
Dual-layer dielectric in memory device
INTEL CORP6 citations82
US9608202B1Mar 28, 2017
Provision of structural integrity in memory device
INTEL CORP2 citations72
US10134809B2Nov 20, 2018
Dual-layer dielectric in memory device
INTEL CORP3 citations70
US10607695B2Mar 31, 2020
Provision of structural integrity in memory device
INTEL CORP0 citations41