Inventor
SUO PENG
SG8 patents
Patents
8 patentsUS11854886B2Dec 26, 2023
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC2 citations70
US11404318B2Aug 2, 2022
Methods of forming through-silicon vias in substrates for advanced packaging
APPLIED MATERIALS INC2 citations70
US11791094B2Oct 17, 2023
Semiconductor substrate having magnetic core inductor
APPLIED MATERIALS INC0 citations62
US11373803B2Jun 28, 2022
Method of forming a magnetic core on a substrate
APPLIED MATERIALS INC1 citations62
US12374586B2Jul 29, 2025
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC0 citations59
US10636696B1Apr 28, 2020
Methods for forming vias in polymer layers
APPLIED MATERIALS INC0 citations51
US10475735B2Nov 12, 2019
Methods and apparatus for 3D MIM capacitor package processing
APPLIED MATERIALS INC0 citations40
US12518367B2Jan 6, 2026
Defect classification of processed wafers
APPLIED MATERIALS INC0 citations35