P

Inventor

BROCKMEIER ANDRE

AT33 patents
⚠️ This page may combine multiple inventors who share the name “BROCKMEIER ANDRE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

29 patents
US10615040B2Apr 7, 2020

Superjunction structure in a power semiconductor device

INFINEON TECHNOLOGIES AG3 citations73
US10276656B2Apr 30, 2019

Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure

INFINEON TECHNOLOGIES AG2 citations73
US9601376B2Mar 21, 2017

Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion

INFINEON TECHNOLOGIES AG2 citations73
US9570542B2Feb 14, 2017

Semiconductor device including a vertical edge termination structure and method of manufacturing

INFINEON TECHNOLOGIES AG4 citations73
US9503823B2Nov 22, 2016

Capacitive microphone with insulated conductive plate

INFINEON TECHNOLOGIES AG5 citations73
US11211459B2Dec 28, 2021

Semiconductor device and method of manufacturing a semiconductor device

INFINEON TECHNOLOGIES AG5 citations71
US9847235B2Dec 19, 2017

Semiconductor device with plated lead frame, and method for manufacturing thereof

INFINEON TECHNOLOGIES AG3 citations71
US11393784B2Jul 19, 2022

Semiconductor package devices and method for forming semiconductor package devices

INFINEON TECHNOLOGIES AG0 citations62
US11148943B2Oct 19, 2021

Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces

INFINEON TECHNOLOGIES AG0 citations62
US11046577B2Jun 29, 2021

Method for processing a monocrystalline substrate and micromechanical structure

INFINEON TECHNOLOGIES AG0 citations62
US9385075B2Jul 5, 2016

Glass carrier with embedded semiconductor device and metal layers on the top surface

INFINEON TECHNOLOGIES AG2 citations62
US11787686B2Oct 17, 2023

Method for processing a layer structure and microelectromechanical component

INFINEON TECHNOLOGIES AG0 citations61
US11576259B2Feb 7, 2023

Carrier, laminate and method of manufacturing semiconductor devices

INFINEON TECHNOLOGIES AG0 citations61
US11180362B2Nov 23, 2021

Method for processing a layer structure and microelectromechanical component

INFINEON TECHNOLOGIES AG0 citations61
US11990520B2May 21, 2024

Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures

INFINEON TECHNOLOGIES AG0 citations60
US11939216B2Mar 26, 2024

Method with stealth dicing process for fabricating MEMS semiconductor chips

INFINEON TECHNOLOGIES AG0 citations55
US10611630B2Apr 7, 2020

Method for processing a monocrystalline substrate and micromechanical structure

INFINEON TECHNOLOGIES AG0 citations52
US10403468B2Sep 3, 2019

Energy filter for processing a power semiconductor device

INFINEON TECHNOLOGIES AG0 citations52
US10242840B2Mar 26, 2019

Energy filter for processing a power semiconductor device

INFINEON TECHNOLOGIES AG0 citations52
US10049912B2Aug 14, 2018

Method of manufacturing a semiconductor device having a vertical edge termination structure

INFINEON TECHNOLOGIES AG0 citations52
US10766766B2Sep 8, 2020

Method for processing a layer structure and microelectromechanical component

INFINEON TECHNOLOGIES AG0 citations51
US10112861B2Oct 30, 2018

Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrate

INFINEON TECHNOLOGIES AG1 citations51
US10748787B2Aug 18, 2020

Semiconductor device with plated lead frame

INFINEON TECHNOLOGIES AG0 citations50
US12534360B2Jan 27, 2026

Generating a MEMS device with glass cover and MEMS device

INFINEON TECHNOLOGIES AG0 citations49
US12372780B2Jul 29, 2025

3D dome wafer-level package for optical mems mirror with reduced footprint

INFINEON TECHNOLOGIES AG0 citations49
US12415719B2Sep 16, 2025

MEMS sensor with particle filter and method for producing it

INFINEON TECHNOLOGIES AG0 citations47
US12060266B2Aug 13, 2024

Method with mechanical dicing process for producing MEMS components

INFINEON TECHNOLOGIES AG0 citations43
US9428381B2Aug 30, 2016

Devices with thinned wafer

INFINEON TECHNOLOGIES AG0 citations42
US9439017B2Sep 6, 2016

Method for manufacturing a plurality of microphone structures, microphone and mobile device

INFINEON TECHNOLOGIES AG0 citations40

BREYMESSER ALEXANDER

2 patents

VON KOBLINSKI CARSTEN

1 patent

INFINEON TECHNOLOGIES AUSTRIA AG

1 patent