Inventor
NICHOLSON LEE M
US22 patents
⚠️ This page may combine multiple inventors who share the name “NICHOLSON LEE M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS7405147B2Jul 29, 2008
Device and methodology for reducing effective dielectric constant in semiconductor devices
IBM35 citations96
US7892940B2Feb 22, 2011
Device and methodology for reducing effective dielectric constant in semiconductor devices
IBM11 citations93
US7015150B2Mar 21, 2006
Exposed pore sealing post patterning
IBM42 citations93
US6960519B1Nov 1, 2005
Interconnect structure improvements
IBM43 citations93
US6838355B1Jan 4, 2005
Damascene interconnect structures including etchback for low-k dielectric materials
IBM54 citations93
US7098544B2Aug 29, 2006
Edge seal for integrated circuit chips
IBM21 citations92
US8343868B2Jan 1, 2013
Device and methodology for reducing effective dielectric constant in semiconductor devices
IBM6 citations84
US7407879B2Aug 5, 2008
Chemical planarization performance for copper/low-k interconnect structures
IBM10 citations84
US7273770B2Sep 25, 2007
Compliant passivated edge seal for low-k interconnect structures
IBM14 citations84
US7592685B2Sep 22, 2009
Device and methodology for reducing effective dielectric constant in semiconductor devices
IBM7 citations74
US7541679B2Jun 2, 2009
Exposed pore sealing post patterning
IBM5 citations74
US7071539B2Jul 4, 2006
Chemical planarization performance for copper/low-k interconnect structures
IBM8 citations73
US6849563B2Feb 1, 2005
Method and apparatus for controlling coating thickness
IBM10 citations72