Inventor
SHIN SEUNGHUN
KR10 patents
⚠️ This page may combine multiple inventors who share the name “SHIN SEUNGHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS11424172B2Aug 23, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD6 citations83
US11869821B2Jan 9, 2024
Semiconductor package having molding layer with inclined side wall
SAMSUNG ELECTRONICS CO LTD4 citations72
US10418335B2Sep 17, 2019
Substrate, method of sawing substrate, and semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations70
US11393801B2Jul 19, 2022
Discrete decoupling capacitor and integrated circuit chip package including same
SAMSUNG ELECTRONICS CO LTD4 citations65
US12094794B2Sep 17, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11515226B2Nov 29, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US10916509B2Feb 9, 2021
Substrate, method of sawing substrate, and semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations59
US10283846B2May 7, 2019
Electronic device including metal housing antenna
SAMSUNG ELECTRONICS CO LTD1 citations53