P

Inventor

LIN KUN-CHI

TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN KUN-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

35 patents
US6417065B1Jul 9, 2002

Method of fabricating a bottom electrode

UNITED MICROELECTRONICS CORP21 citations92
US6100158AAug 8, 2000

Method of manufacturing an alignment mark with an etched back dielectric layer and a transparent dielectric layer and a device region on a higher plane with a wiring layer and an isolation region

UNITED MICROELECTRONICS CORP27 citations92
US6100014AAug 8, 2000

Method of forming an opening in a dielectric layer through a photoresist layer with silylated sidewall spacers

UNITED MICROELECTRONICS CORP51 citations92
US6570246B1May 27, 2003

Multi-die package

UNITED MICROELECTRONICS CORP13 citations84
US6432772B1Aug 13, 2002

Method of forming a lower storage node of a capacitor

UNITED MICROELECTRONICS CORP19 citations84
US6238974B1May 29, 2001

Method of forming DRAM capacitors with a native oxide etch-stop

UNITED MICROELECTRONICS CORP16 citations84
US6150223ANov 21, 2000

Method for forming gate spacers with different widths

UNITED MICROELECTRONICS CORP16 citations80
US6255229B1Jul 3, 2001

Method for forming semiconductor dielectric layer

UNITED MICROELECTRONICS CORP10 citations74
US6218271B1Apr 17, 2001

Method of forming a landing pad on the drain and source of a MOS transistor

UNITED MICROELECTRONICS CORP7 citations74
US6124161ASep 26, 2000

Method for fabricating a hemispherical silicon grain layer

UNITED MICROELECTRONICS CORP12 citations74
US6074955AJun 13, 2000

Method of fabricating a node contact window of DRAM

UNITED MICROELECTRONICS CORP11 citations74
US6429135B1Aug 6, 2002

Method of reducing stress between a nitride silicon spacer and a substrate

UNITED MICROELECTRONICS CORP10 citations73
US6413832B1Jul 2, 2002

Method for forming inner-cylindrical capacitor without top electrode mask

UNITED MICROELECTRONICS CORP8 citations73
US6365955B1Apr 2, 2002

Cylindrical capacitor structure and method of manufacture

UNITED MICROELECTRONICS CORP7 citations73
US6365454B1Apr 2, 2002

Cylindrical capacitor structure and method of manufacture

UNITED MICROELECTRONICS CORP8 citations73
US6200904B1Mar 13, 2001

Method of forming a contact hole of a DRAM

UNITED MICROELECTRONICS CORP12 citations72
US6140168AOct 31, 2000

Method of fabricating self-aligned contact window

UNITED MICROELECTRONICS CORP15 citations72
US6465360B2Oct 15, 2002

Method for fabricating an ultra small opening

UNITED MICROELECTRONICS CORP8 citations71
US6204107B1Mar 20, 2001

Method for forming multi-layered liner on sidewall of node contact opening

UNITED MICROELECTRONICS CORP9 citations71
US6150263ANov 21, 2000

Method of fabricating small dimension wires

UNITED MICROELECTRONICS CORP7 citations71
US6159806ADec 12, 2000

Method for increasing the effective spacer width

UNITED MICROELECTRONICS CORP7 citations68
US6667234B2Dec 23, 2003

Method of fabricating node contacts

UNITED MICROELECTRONICS CORP4 citations63
US6316341B1Nov 13, 2001

Method for cell pass transistor design in DRAM process

UNITED MICROELECTRONICS CORP2 citations63
US6297139B1Oct 2, 2001

Method of forming a contact hole in a semiconductor wafer

UNITED MICROELECTRONICS CORP6 citations63
US6188116B1Feb 13, 2001

Structure of a polysilicon plug

UNITED MICROELECTRONICS CORP3 citations63
US6479355B2Nov 12, 2002

Method for forming landing pad

UNITED MICROELECTRONICS CORP5 citations62
US6329244B1Dec 11, 2001

Method of manufacturing dynamic random access memory cell

UNITED MICROELECTRONICS CORP6 citations62
US6150216ANov 21, 2000

Method for forming an electrode of semiconductor device capacitor

UNITED MICROELECTRONICS CORP4 citations62
US6096594AAug 1, 2000

Fabricating method of a dynamic random access memory

UNITED MICROELECTRONICS CORP6 citations62
US6218243B1Apr 17, 2001

Method of fabricating a DRAM capacitor

UNITED MICROELECTRONICS CORP2 citations61
US6150278ANov 21, 2000

Method of fabricating node capacitor for DRAM processes

UNITED MICROELECTRONICS CORP4 citations61
US6136642AOct 24, 2000

Method of making a dynamic random access memory

UNITED MICROELECTRONICS CORP4 citations61
US6225160B1May 1, 2001

Method of manufacturing bottom electrode of capacitor

UNITED MICROELECTRONICS CORP6 citations60
US6162678ADec 19, 2000

Simple small feature size bit line formation in DRAM with RTO oxidation

UNITED MICROELECTRONICS CORP2 citations60
US6140202AOct 31, 2000

Method of fabricating double-cylinder capacitor

UNITED MICROELECTRONICS CORP1 citations52

DELTA ELECTRONICS INC

6 patents

UNITED MICROELECTONICS CORP

1 patent