Inventor
OSHIMA YOSHIO
JP10 patents
Patents
10 patentsUS5176310AJan 5, 1993
Method and apparatus for wire bond
HITACHI LTD100 citations95
US5110032AMay 5, 1992
Method and apparatus for wire bonding
HITACHI LTD72 citations95
US5037023AAug 6, 1991
Method and apparatus for wire bonding
HITACHI LTD53 citations95
US5210844AMay 11, 1993
System using selected logical processor identification based upon a select address for accessing corresponding partition blocks of the main memory
HITACHI LTD117 citations93
US5060841AOct 29, 1991
wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
HITACHI LTD35 citations91
US4677583AJun 30, 1987
Apparatus for decimal multiplication
HITACHI LTD16 citations71
US4635220AJan 6, 1987
Binary coded decimal number division apparatus
HITACHI LTD11 citations71
US4603397AJul 29, 1986
Binary coded decimal number division apparatus
HITACHI LTD14 citations71
US5226132AJul 6, 1993
Multiple virtual addressing using/comparing translation pairs of addresses comprising a space address and an origin address (sto) while using space registers as storage devices for a data processing system
HITACHI LTD18 citations70
US4543641ASep 24, 1985
Multiplication device using multiple-input adder
HITACHI LTD6 citations60