Inventor
DOWSING III JOHN E
US4 patents
Patents
4 patentsUS5541565AJul 30, 1996
High frequency microelectronic circuit enclosure
TRW INC17 citations68
US5402003AMar 28, 1995
Low dielectric constant interconnect for multichip modules
TRW INC9 citations67
US6028007AFeb 22, 2000
Low cost hermetic sealed microwave module packaging
TRW INC0 citations48
US5956840ASep 28, 1999
Low cost hermetic sealed microwave module packaging
TRW INC1 citations48