Inventor
MURAI SHIROU
JP8 patents
Patents
8 patentsUS6302769B1Oct 16, 2001
Method for chamfering a wafer
NIPPEI TOYAMA CORP45 citations91
US6332834B1Dec 25, 2001
Method and apparatus for grinding a workpiece
NIPPEI TOYAMA CORP18 citations81
US6439969B1Aug 27, 2002
Apparatus and method of chamfering wafer
NIPPEI TOYAMA CORP18 citations79
US6296553B1Oct 2, 2001
Grinding method, surface grinder, workpiece support, mechanism and work rest
NIPPEI TOYAMA CORP11 citations72
US6220931B1Apr 24, 2001
Feeding a grinding wheel in grinding method
NIPPEI TOYAMA CORP8 citations72
US6036585AMar 14, 2000
Grinder and grinding method
NIPPEI TOYAMA CORP7 citations72
US6113489ASep 5, 2000
Ingot slicing method, an ingot manufacturing method and a sliced ingot grinding apparatus
NIPPEI TOYAMA CORP8 citations70
US6722956B2Apr 20, 2004
Working apparatus
NIPPEI TOYAMA CORP9 citations68