Inventor

VAN SCHRAVENDIJK BART J

US65 patents

⚠️ This page may combine multiple inventors who share the name “VAN SCHRAVENDIJK BART J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VAN SCHRAVENDIJK BART J

LAM RES CORP

Selective inhibition in atomic layer deposition of silicon-containing films

Selective inhibition in atomic layer deposition of silicon-containing films

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Tin oxide thin film spacers in semiconductor device manufacturing

Apparatus and method for deposition and etch in gap fill

Method to create air gaps

Tin oxide thin film spacers in semiconductor device manufacturing

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Staircase encapsulation in 3D NAND fabrication

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Tin oxide thin film spacers in semiconductor device manufacturing

Apparatus and method for deposition and etch in gap fill

Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma

Sacrificial pre-metal dielectric for self-aligned contact scheme

Selective atomic layer deposition with post-dose treatment

Methods of encapsulation

Tin oxide thin film spacers in semiconductor device manufacturing

Selective inhibition in atomic layer deposition of silicon-containing films

Staircase encapsulation in 3D NAND fabrication

Method to create air gaps

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Selective atomic layer deposition with post-dose treatment

Gap fill using carbon-based films

Geometrically selective deposition of a dielectric film

Methods of encapsulation

Treatment for flowable dielectric deposition on substrate surfaces

Sacrificial pre-metal dielectric for self-aligned contact scheme

Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor

Gapfill of variable aspect ratio features with a composite PEALD and PECVD method

Method to create air gaps

Tin oxide thin film spacers in semiconductor device manufacturing

Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma

Integrated direct dielectric and metal deposition

Apparatus and method for deposition and etch in gap fill

Image reversal with AHM gap fill for multiple patterning

Modulated atomic layer deposition

Methods of encapsulation

NOVELLUS SYSTEMS INC

Methods to improve chemical vapor deposited fluorosilicate glass (FSG) film adhesion to metal barrier or etch stop/diffusion barrier layers

Chemical vapor deposition system including dedicated cleaning gas injection

Device for removing dissolved gas from a liquid

Plasma activated conformal film deposition

Treatment of low k films with a silylating agent for damage repair

Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copper

Device for removing dissolved gas from a liquid

Device for removing dissolved gas from a liquid

Radical source design for remote plasma atomic layer deposition

PECVD apparatus for in-situ deposition of film stacks

Radical source design for remote plasma atomic layer deposition

LAVOIE ADRIEN

Plasma activated conformal film deposition

SWAMINATHAN SHANKAR

Plasma activated conformal dielectric film deposition