Inventor

MAO KUO-LIANG

TW2 patents

Patents

2 patents

US6404064B1Jun 11, 2002

Flip-chip bonding structure on substrate for flip-chip package application

SILICONWARE PRECISION INDUSTRIES CO LTD38 citations90

US6348740B1Feb 19, 2002

Bump structure with dopants

SILICONWARE PRECISION INDUSTRIES CO LTD17 citations81