Inventor
SUO CHAO-DUNG
TW4 patents
Patents
4 patentsUS6404064B1Jun 11, 2002
Flip-chip bonding structure on substrate for flip-chip package application
SILICONWARE PRECISION INDUSTRIES CO LTD38 citations90
US6348401B1Feb 19, 2002
Method of fabricating solder bumps with high coplanarity for flip-chip application
SILICONWARE PRECISION INDUSTRIES CO LTD38 citations90
US7489037B2Feb 10, 2009
Semiconductor device and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD15 citations82
US6348740B1Feb 19, 2002
Bump structure with dopants
SILICONWARE PRECISION INDUSTRIES CO LTD17 citations81