Inventor
Yazzie Kyle
US13 patents
Patents
13 patentsUS9661745B1May 23, 2017
Vacuum lamination of depth-sensing camera module PCB to stiffener using built-in vacuum channels
INTEL CORP8 citations82
US10957656B2Mar 23, 2021
Integrated circuit packages with patterned protective material
INTEL CORP2 citations66
US10290569B2May 14, 2019
Constrained cure component attach process for improved IC package warpage control
INTEL CORP2 citations64
US12327801B2Jun 10, 2025
Robust mold integrated substrate
INTEL CORP0 citations62
US11322455B2May 3, 2022
Robust mold integrated substrate
INTEL CORP1 citations62
US10998275B2May 4, 2021
Package with cathodic protection for corrosion mitigation
INTEL CORP0 citations60
US11322456B2May 3, 2022
Die back side structures for warpage control
INTEL CORP0 citations59
US11022792B2Jun 1, 2021
Coupling a magnet with a MEMS device
INTEL CORP0 citations59
US10985080B2Apr 20, 2021
Electronic package that includes lamination layer
INTEL CORP0 citations59
US11327050B2May 10, 2022
Mechanical failure monitoring, detection, and classification in electronic assemblies
INTEL CORP1 citations55
US10049987B2Aug 14, 2018
Enhanced fiducial visibility and recognition
INTEL CORP0 citations51
US10499461B2Dec 3, 2019
Thermal head with a thermal barrier for integrated circuit die processing
INTEL CORP0 citations50
US10278318B2Apr 30, 2019
Method of assembling an electronic component using a probe having a fluid thereon
INTEL CORP0 citations36