Inventor
HAIGH JR THOMAS J
US16 patents
⚠️ This page may combine multiple inventors who share the name “HAIGH JR THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS8652950B2Feb 18, 2014
C-rich carbon boron nitride dielectric films for use in electronic devices
IBM5 citations84
US9735005B1Aug 15, 2017
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
IBM2 citations73
US8362596B2Jan 29, 2013
Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same
IBM4 citations63
US11791398B2Oct 17, 2023
Nano multilayer carbon-rich low-k spacer
IBM0 citations62
US10937892B2Mar 2, 2021
Nano multilayer carbon-rich low-k spacer
IBM0 citations62
US11756786B2Sep 12, 2023
Forming high carbon content flowable dielectric film with low processing damage
IBM0 citations60
US10242865B2Mar 26, 2019
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
IBM0 citations52
US10236176B2Mar 19, 2019
Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices
IBM0 citations52
US9105642B2Aug 11, 2015
Interlevel dielectric stack for interconnect structures
IBM0 citations52
US9018767B2Apr 28, 2015
Interlevel dielectric stack for interconnect structures
IBM0 citations52
NGUYEN SON VAN
4 patentsUS8779600B2Jul 15, 2014
Interlevel dielectric stack for interconnect structures
NGUYEN SON VAN8 citations83
US8476743B2Jul 2, 2013
C-rich carbon boron nitride dielectric films for use in electronic devices
NGUYEN SON VAN6 citations83
US8299365B2Oct 30, 2012
Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures
NGUYEN SON VAN10 citations83
US9502288B2Nov 22, 2016
Method of forming an interconnect structure
NGUYEN SON VAN5 citations72