Inventor
NOMA HIROKAZU
JP8 patents
⚠️ This page may combine multiple inventors who share the name “NOMA HIROKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS9354408B2May 31, 2016
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM12 citations83
US7484293B2Feb 3, 2009
Semiconductor package and manufacturing method therefor
IBM10 citations82
US9772462B2Sep 26, 2017
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM2 citations72
US9684237B2Jun 20, 2017
Circuit board formation using organic substrates
IBM2 citations72
US9698119B2Jul 4, 2017
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations71
US9391034B2Jul 12, 2016
Interfacial alloy layer for improving electromigration (EM) resistance in solder joints
IBM2 citations61
US9760002B2Sep 12, 2017
Circuit board formation using organic substrates
IBM0 citations51