Inventor

TSAI YING-HSIU

TW3 patents

⚠️ This page may combine multiple inventors who share the name “TSAI YING-HSIU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

2 patents

US10272540B2Apr 30, 2019

System and method for polishing substrate

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations67

US9669514B2Jun 6, 2017

System and method for polishing substrate

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations46

TAIWAN SEMICONDUCTOR MFG

1 patent

US8021992B2Sep 20, 2011

High aspect ratio gap fill application using high density plasma chemical vapor deposition

TAIWAN SEMICONDUCTOR MFG21 citations90