Inventor
HUANG CHIH-CHANG
TW21 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHIH-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS10134801B2Nov 20, 2018
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11417700B2Aug 16, 2022
Image sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10741601B2Aug 11, 2020
Image sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10074594B2Sep 11, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9691804B2Jun 27, 2017
Image sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12557401B2Feb 17, 2026
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404470B2Aug 2, 2022
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11018176B2May 25, 2021
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9620555B2Apr 11, 2017
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11854980B2Dec 26, 2023
Method for forming titanium nitride barrier with small surface grains in interconnects
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10867889B2Dec 15, 2020
Method of manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10510798B2Dec 17, 2019
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10157953B2Dec 18, 2018
Image sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10276621B2Apr 30, 2019
Metal shielding layer in backside illumination image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10796996B2Oct 6, 2020
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48