Inventor
LEE CHOON HEUNG
KR38 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHOON HEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
28 patentsUS6982485B1Jan 3, 2006
Stacking structure for semiconductor chips and a semiconductor package using it
AMKOR TECHNOLOGY INC69 citations98
US7359204B1Apr 15, 2008
Multiple cover memory card
AMKOR TECHNOLOGY INC57 citations97
US6995459B2Feb 7, 2006
Semiconductor package with increased number of input and output pins
AMKOR TECHNOLOGY INC129 citations97
US6927483B1Aug 9, 2005
Semiconductor package exhibiting efficient lead placement
AMKOR TECHNOLOGY INC127 citations97
US6876068B1Apr 5, 2005
Semiconductor package with increased number of input and output pins
AMKOR TECHNOLOGY INC108 citations97
US7042072B1May 9, 2006
Semiconductor package and method of manufacturing the same which reduces warpage
AMKOR TECHNOLOGY INC90 citations95
US7633763B1Dec 15, 2009
Double mold memory card and its manufacturing method
AMKOR TECHNOLOGY INC20 citations92
US7375975B1May 20, 2008
Enhanced durability memory card
AMKOR TECHNOLOGY INC39 citations92
US6936922B1Aug 30, 2005
Semiconductor package structure reducing warpage and manufacturing method thereof
AMKOR TECHNOLOGY INC49 citations92
US6879034B1Apr 12, 2005
Semiconductor package including low temperature co-fired ceramic substrate
AMKOR TECHNOLOGY INC38 citations92
US6750545B1Jun 15, 2004
Semiconductor package capable of die stacking
AMKOR TECHNOLOGY INC34 citations92
US6995448B2Feb 7, 2006
Semiconductor package including passive elements and method of manufacture
AMKOR TECHNOLOGY INC33 citations90
US6469258B1Oct 22, 2002
Circuit board for semiconductor package
AMKOR TECHNOLOGY INC35 citations90
US6867071B1Mar 15, 2005
Leadframe including corner leads and semiconductor package using same
AMKOR TECHNOLOGY INC22 citations88
US9627368B2Apr 18, 2017
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECHNOLOGY INC11 citations84
US7719845B1May 18, 2010
Chamfered memory card module and method of making same
AMKOR TECHNOLOGY INC16 citations84
US7362038B1Apr 22, 2008
Surface acoustic wave (SAW) device package and method for packaging a SAW device
AMKOR TECHNOLOGY INC15 citations84
US7220915B1May 22, 2007
Memory card and its manufacturing method
AMKOR TECHNOLOGY INC18 citations83
US10707181B2Jul 7, 2020
Semiconductor device with redistribution layers formed utilizing dummy substrates
AMKOR TECHNOLOGY INC3 citations73
US10388643B2Aug 20, 2019
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECHNOLOGY INC2 citations73
US10177117B2Jan 8, 2019
Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
AMKOR TECHNOLOGY INC3 citations73
US7201327B1Apr 10, 2007
Memory card and its manufacturing method
AMKOR TECHNOLOGY INC7 citations73
US9412729B2Aug 9, 2016
Semiconductor package and fabricating method thereof
AMKOR TECHNOLOGY INC2 citations63
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
US10903181B2Jan 26, 2021
Wafer level fan out semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations62
US7837120B1Nov 23, 2010
Modular memory card and method of making same
AMKOR TECHNOLOGY INC6 citations62
US10115705B2Oct 30, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US9627348B2Apr 18, 2017
Laser assisted bonding for semiconductor die interconnections
AMKOR TECHNOLOGY INC1 citations50
AMKOR TECH SINGAPORE HOLDING PTE LTD
5 patentsUS12388032B2Aug 12, 2025
Semiconductor device with redistribution layers formed utilizing dummy substrates
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US11600582B2Mar 7, 2023
Semiconductor device with redistribution layers formed utilizing dummy substrates
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations63
US12362343B2Jul 15, 2025
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11855023B2Dec 26, 2023
Wafer level fan out semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11183493B2Nov 23, 2021
Semiconductor device using EMC wafer support system and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62