Inventor
JANG TAE HOAN
KR7 patents
⚠️ This page may combine multiple inventors who share the name “JANG TAE HOAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
4 patentsUS6515356B1Feb 4, 2003
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC79 citations97
US6469258B1Oct 22, 2002
Circuit board for semiconductor package
AMKOR TECHNOLOGY INC35 citations90
US6717248B2Apr 6, 2004
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC27 citations89
US7190071B2Mar 13, 2007
Semiconductor package and method for fabricating the same
AMKOR TECHNOLOGY INC13 citations83
STATS CHIPPAC LTD
3 patentsUS7989356B2Aug 2, 2011
Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability
STATS CHIPPAC LTD18 citations83
US7863726B2Jan 4, 2011
Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof
STATS CHIPPAC LTD3 citations62
US7646105B2Jan 12, 2010
Integrated circuit package system with package substrate having corner contacts
STATS CHIPPAC LTD0 citations51