Inventor
YANG JUN YOUNG
KR19 patents
⚠️ This page may combine multiple inventors who share the name “YANG JUN YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
9 patentsUS6730544B1May 4, 2004
Stackable semiconductor package and method for manufacturing same
AMKOR TECHNOLOGY INC217 citations99
US7045396B2May 16, 2006
Stackable semiconductor package and method for manufacturing same
AMKOR TECHNOLOGY INC174 citations97
US6605866B1Aug 12, 2003
Stackable semiconductor package and method for manufacturing same
AMKOR TECHNOLOGY INC86 citations96
US6879034B1Apr 12, 2005
Semiconductor package including low temperature co-fired ceramic substrate
AMKOR TECHNOLOGY INC38 citations92
US6639308B1Oct 28, 2003
Near chip size semiconductor package
AMKOR TECHNOLOGY INC26 citations91
US6995448B2Feb 7, 2006
Semiconductor package including passive elements and method of manufacture
AMKOR TECHNOLOGY INC33 citations90
US6469258B1Oct 22, 2002
Circuit board for semiconductor package
AMKOR TECHNOLOGY INC35 citations90
US7146106B2Dec 5, 2006
Optic semiconductor module and manufacturing method
AMKOR TECHNOLOGY INC14 citations84
US6646290B1Nov 11, 2003
Optical structure having an optical diode and a sensor in separate apertures inside double insulating layers
AMKOR TECHNOLOGY INC12 citations74
ADVANCED SEMICONDUCTOR ENG
7 patentsUS7700411B2Apr 20, 2010
Semiconductor device package and manufacturing method
ADVANCED SEMICONDUCTOR ENG88 citations96
US7633170B2Dec 15, 2009
Semiconductor device package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG71 citations96
US9236356B2Jan 12, 2016
Semiconductor package with grounding and shielding layers
ADVANCED SEMICONDUCTOR ENG22 citations91
US7166917B2Jan 23, 2007
Semiconductor package having passive component disposed between semiconductor device and substrate
ADVANCED SEMICONDUCTOR ENG33 citations91
US7656047B2Feb 2, 2010
Semiconductor device package and manufacturing method
ADVANCED SEMICONDUCTOR ENG49 citations90
US7439098B2Oct 21, 2008
Semiconductor package for encapsulating multiple dies and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG21 citations87
US7833837B2Nov 16, 2010
Chip scale package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG12 citations82