Inventor
NAM BYEONG-YUN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “NAM BYEONG-YUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS6885052B2Apr 26, 2005
Semiconductor memory device having self-aligned contacts and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations92
US6573551B1Jun 3, 2003
Semiconductor memory device having self-aligned contact and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD23 citations92
US6573168B2Jun 3, 2003
Methods for forming conductive contact body for integrated circuits using dummy dielectric layer
SAMSUNG ELECTRONICS CO LTD28 citations92
US6169009B1Jan 2, 2001
Methods of etching platinum group metal film and forming lower electrode of capacitor
SAMSUNG ELECTRONICS CO LTD25 citations91
US6004882ADec 21, 1999
Method for etching Pt film of semiconductor device
SAMSUNG ELECTRONICS CO LTD19 citations90
US6054391AApr 25, 2000
Method for etching a platinum layer in a semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations82
US7247540B2Jul 24, 2007
Methods of forming field effect transistors having recessed channel regions
SAMSUNG ELECTRONICS CO LTD7 citations74
US7009257B2Mar 7, 2006
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad and integrated circuit devices formed thereby
SAMSUNG ELECTRONICS CO LTD5 citations74
US6953744B2Oct 11, 2005
Methods of fabricating integrated circuit devices providing improved short prevention
SAMSUNG ELECTRONICS CO LTD8 citations74
US6689654B2Feb 10, 2004
Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad
SAMSUNG ELECTRONICS CO LTD6 citations74
US6680511B2Jan 20, 2004
Integrated circuit devices providing improved short prevention
SAMSUNG ELECTRONICS CO LTD9 citations74
US6576963B2Jun 10, 2003
Semiconductor device having transistor
SAMSUNG ELECTRONICS CO LTD9 citations74
US6429107B2Aug 6, 2002
Method for forming conductive contact of semiconductor device
SAMSUNG ELECTRONICS CO LTD9 citations74
US5693546ADec 2, 1997
Methods of forming thin film transistors having lightly-doped drain and source regions therein
SAMSUNG ELECTRONICS CO LTD13 citations74
US7226867B2Jun 5, 2007
Method of etching a metal layer using a mask, a metallization method for a semiconductor device, a method of etching a metal layer, and an etching gas
SAMSUNG ELECTRONICS CO LTD7 citations73
US7132708B2Nov 7, 2006
Semiconductor memory device having self-aligned contacts and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US6187686B1Feb 13, 2001
Methods for forming patterned platinum layers using masking layers including titanium and related structures
SAMSUNG ELECTRONICS CO LTD7 citations73
US7312130B2Dec 25, 2007
Methods of forming capacitor structures including L-shaped cavities
SAMSUNG ELECTRONICS CO LTD9 citations71
US7125766B2Oct 24, 2006
Method of forming capacitor for semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations63
US6498081B2Dec 24, 2002
Method of manufacturing self-aligned contact hole
SAMSUNG ELECTRONICS CO LTD2 citations63
US6984568B2Jan 10, 2006
Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US6664585B2Dec 16, 2003
Semiconductor memory device having multilayered storage node contact plug and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7867841B2Jan 11, 2011
Methods of forming semiconductor devices with extended active regions
SAMSUNG ELECTRONICS CO LTD4 citations58
US7329574B2Feb 12, 2008
Methods of forming capacitor electrodes using fluorine and oxygen
SAMSUNG ELECTRONICS CO LTD0 citations52
US7060575B2Jun 13, 2006
Semiconductor device having transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US6682975B2Jan 27, 2004
Semiconductor memory device having self-aligned contact and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52