Inventor · disambiguated record
Yuying Wei
Also filed as: WEI YUYING
4 granted patents·2 pending applications·5 citations·filing 2012–2022
64Inventor score
Top patents by PatentIndex Score
6 records- 0178US11282717B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2018·Granted Mar 22, 2022·2 cites·12 claims
- 0269US11776821B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 0368US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 0450US10115606B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyINTEL CORP·Filed 2016·Granted Oct 30, 2018·0 cites·23 claims
- 0536US2020006169A1Micro-electronic package with barrier structureINTEL CORP·Filed 2018·Application pending·0 cites
- 0629US2017053858A1Substrate on substrate packageINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →