Inventor
GAINES R STOCKTON
US36 patents
⚠️ This page may combine multiple inventors who share the name “GAINES R STOCKTON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ACORN TECH INC
22 patentsUS5961582AOct 5, 1999
Distributed and portable execution environment
ACORN TECH INC252 citations99
US6594103B1Jul 15, 2003
Read channel generating absolute value servo signal
ACORN TECH INC75 citations97
US7700416B1Apr 20, 2010
Tensile strained semiconductor on insulator using elastic edge relaxation and a sacrificial stressor layer
ACORN TECH INC53 citations94
US9362376B2Jun 7, 2016
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN TECH INC13 citations92
US9270083B2Feb 23, 2016
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN TECH INC10 citations92
US9036672B2May 19, 2015
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN TECH INC12 citations92
US7851325B1Dec 14, 2010
Strained semiconductor using elastic edge relaxation, a buried stressor layer and a sacrificial stressor layer
ACORN TECH INC23 citations92
US6525897B2Feb 25, 2003
Apparatus for developing a dynamic servo signal from data in a magnetic disc drive and method
ACORN TECH INC24 citations92
US6381088B1Apr 30, 2002
Apparatus for developing a dynamic servo signal from data in a magnetic disc drive and method
ACORN TECH INC22 citations92
US10193307B2Jan 29, 2019
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN TECH INC4 citations84
US7972916B1Jul 5, 2011
Method of forming a field effect transistors with a sacrificial stressor layer and strained source and drain regions formed in recesses
ACORN TECH INC14 citations84
US7756196B1Jul 13, 2010
Efficient adaptive filters for CDMA wireless systems
ACORN TECH INC16 citations84
US6397369B1May 28, 2002
Device for using information about the extent of errors in a signal and method
ACORN TECH INC13 citations73
US8003486B2Aug 23, 2011
Method of making a semiconductor device having a strained semiconductor active region using edge relaxation, a buried stressor layer and a sacrificial stressor layer
ACORN TECH INC4 citations63
US10727647B2Jul 28, 2020
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN TECH INC0 citations52
US10580896B2Mar 3, 2020
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN TECH INC0 citations52
US10505005B2Dec 10, 2019
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN TECH INC0 citations52
US10084091B2Sep 25, 2018
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN TECH INC0 citations52
US10008827B2Jun 26, 2018
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN TECH INC0 citations52
US9755038B2Sep 5, 2017
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN TECH INC0 citations52
US9673327B2Jun 6, 2017
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN TECH INC0 citations52
US9484426B2Nov 1, 2016
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN TECH INC0 citations52
ACORN SEMI LLC
10 patentsUS11728624B2Aug 15, 2023
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN SEMI LLC2 citations73
US12557347B2Feb 17, 2026
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN SEMI LLC0 citations62
US12336263B2Jun 17, 2025
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN SEMI LLC0 citations62
US11978800B2May 7, 2024
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN SEMI LLC0 citations62
US11804533B2Oct 31, 2023
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN SEMI LLC0 citations62
US11610974B2Mar 21, 2023
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN SEMI LLC0 citations62
US11476364B2Oct 18, 2022
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN SEMI LLC0 citations62
US11271370B2Mar 8, 2022
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
ACORN SEMI LLC0 citations62
US10950727B2Mar 16, 2021
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
ACORN SEMI LLC0 citations62
US10879366B2Dec 29, 2020
Metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
ACORN SEMI LLC0 citations52
CLIFTON PAUL A
3 patentsUS8731017B2May 20, 2014
Tensile strained semiconductor photon emission and detection devices and integrated photonics system
CLIFTON PAUL A26 citations95
US8395213B2Mar 12, 2013
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
CLIFTON PAUL A12 citations83
US9406798B2Aug 2, 2016
Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
CLIFTON PAUL A2 citations62