Inventor

MINAMI HISATAKA

JP20 patents

⚠️ This page may combine multiple inventors who share the name “MINAMI HISATAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MINAMI HISATAKA

HITACHI CHEMICAL CO LTD

Abrasive, abrasive set, and method for abrading substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Polishing agent, polishing agent set and method for polishing base

Abrasive, abrasive set, and method for abrading substrate

Polishing liquid for CMP, and polishing method

Slurry, polishing-liquid set, polishing liquid, and polishing method for base

Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate

Polishing liquid, polishing liquid set, and substrate polishing method

Abrasive, abrasive set, and method for polishing substrate

Polishing agent, polishing agent set, and substrate polishing method

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate

Abrasive, abrasive set, and method for polishing substrate

MINAMI HISATAKA

CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material

CMP polishing solution and polishing method

CMP fluid and method for polishing palladium

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

SHOWA DENKO MATERIALS CO LTD

Polishing solution and polishing method

IWANO TOMOHIRO

Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid