Inventor
SON HO YOUNG
KR20 patents
⚠️ This page may combine multiple inventors who share the name “SON HO YOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
11 patentsUS9570370B2Feb 14, 2017
Multi chip package and method for manufacturing the same
SK HYNIX INC3 citations73
US12009308B2Jun 11, 2024
Semiconductor chip including through electrodes, and semiconductor package including the same
SK HYNIX INC2 citations72
US11823982B2Nov 21, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US11594471B2Feb 28, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US12500176B2Dec 16, 2025
Semiconductor chip including through electrodes, and semiconductor package including the same
SK HYNIX INC0 citations62
US12463114B2Nov 4, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
US12327779B2Jun 10, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
US11502051B2Nov 15, 2022
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations60
US10014278B2Jul 3, 2018
Semiconductor chip and stacked semiconductor package having the same
SK HYNIX INC0 citations51
US9159709B2Oct 13, 2015
Semiconductor chip and stacked semiconductor package having the same
SK HYNIX INC1 citations51
US9040419B2May 26, 2015
Semiconductor package and method for manufacturing the same
SK HYNIX INC1 citations51
SON HO YOUNG
4 patentsUS8310045B2Nov 13, 2012
Semiconductor package with heat dissipation devices
SON HO YOUNG11 citations82
US8816477B2Aug 26, 2014
Semiconductor package having a contamination preventing layer formed in the semiconductor chip
SON HO YOUNG4 citations71
US8669642B2Mar 11, 2014
Semiconductor chip and fabricating method thereof
SON HO YOUNG2 citations60
US8217434B2Jul 10, 2012
Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same
SON HO YOUNG0 citations40