Inventor
NISHIMURA TETSURO
JP31 patents
⚠️ This page may combine multiple inventors who share the name “NISHIMURA TETSURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIHON SUPERIOR CO LTD
9 patentsUS5487868AJan 30, 1996
Tin based solder alloy containing lead, antimony, and tellurium
NIHON SUPERIOR CO LTD9 citations72
US12521822B2Jan 13, 2026
Sn solder paste comprising cu-co metal particles
NIHON SUPERIOR CO LTD0 citations61
US12377501B2Aug 5, 2025
Solder preform containing Cu—Co particles
NIHON SUPERIOR CO LTD0 citations61
US11839937B2Dec 12, 2023
Lead-free solder alloy and solder joint part
NIHON SUPERIOR CO LTD1 citations61
US12172242B2Dec 24, 2024
Lead-free solder alloy
NIHON SUPERIOR CO LTD0 citations56
US10286497B2May 14, 2019
Lead-free solder alloy
NIHON SUPERIOR CO LTD0 citations51
US9999936B2Jun 19, 2018
Solder wire bobbinless coil
NIHON SUPERIOR CO LTD0 citations51
US10329642B2Jun 25, 2019
Solder alloy and joint thereof
NIHON SUPERIOR CO LTD0 citations44
US11980974B2May 14, 2024
Solder joint part and method for manufacturing the same
NIHON SUPERIOR CO LTD0 citations42
NISHIMURA TETSURO
7 patentsUS8999519B2Apr 7, 2015
Solder joint
NISHIMURA TETSURO3 citations61
US8557021B2Oct 15, 2013
Method of regulating nickel concentration in lead-free solder containing nickel
NISHIMURA TETSURO2 citations61
US9339893B2May 17, 2016
Lead-free solder alloy
NISHIMURA TETSURO1 citations51
US8163061B2Apr 24, 2012
Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin
NISHIMURA TETSURO0 citations51
US8652269B2Feb 18, 2014
Flux composition and soldering paste composition
NISHIMURA TETSURO0 citations45
US9999945B2Jun 19, 2018
Solder alloy
NISHIMURA TETSURO1 citations40
US8147746B2Apr 3, 2012
Apparatus for precipitation/separation of excess copper in lead-free solder
NISHIMURA TETSURO0 citations40
TERUMO CORP
5 patentsUS4911696AMar 27, 1990
Branch tube
TERUMO CORP26 citations91
US4899903AFeb 13, 1990
Tube assembly provided with a breakaway plug
TERUMO CORP32 citations91
US4915704AApr 10, 1990
Tube assembly with a breakaway plug
TERUMO CORP13 citations70
US4657535AApr 14, 1987
Medical needle device and medical equipment having the same
TERUMO CORP12 citations68
USD297367SAug 23, 1988
Manifold for connecting tubes in blood administration equipment
TERUMO CORP4 citations59
NIHON SUPERIOR SHA CO LTD
4 patentsUS6296722B1Oct 2, 2001
Lead-free solder alloy
NIHON SUPERIOR SHA CO LTD30 citations91
US6699306B2Mar 2, 2004
Control method for copper density in a solder dipping bath
NIHON SUPERIOR SHA CO LTD7 citations71
US7861909B2Jan 4, 2011
Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath
NIHON SUPERIOR SHA CO LTD1 citations51
US7591873B2Sep 22, 2009
Method of copper precipitation in lead-free solder, granulation and separation of (CuX)6Sn5 compounds and recovery of tin
NIHON SUPERIOR SHA CO LTD0 citations51