Inventor
HASHEMI SEYED H
US14 patents
⚠️ This page may combine multiple inventors who share the name “HASHEMI SEYED H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNISYS CORP
7 patentsUS5491787AFeb 13, 1996
Fault tolerant digital computer system having two processors which periodically alternate as master and slave
UNISYS CORP101 citations95
US5396596AMar 7, 1995
Mass data storage and retrieval system providing multiple transfer paths with multiple buffer memories
UNISYS CORP86 citations95
US5337414AAug 9, 1994
Mass data storage and retrieval system
UNISYS CORP76 citations95
US5574865ANov 12, 1996
System for data transfer protection during module connection/disconnection onto live bus
UNISYS CORP29 citations92
US5490263AFeb 6, 1996
Multiported buffer memory system for disk drive complex
UNISYS CORP21 citations92
US5471586ANov 28, 1995
Interface system having plurality of channels and associated independent controllers for transferring data between shared buffer and peripheral devices independently
UNISYS CORP31 citations92
US5455914AOct 3, 1995
Tie-breaking control circuit for bus modules which share command execution
UNISYS CORP4 citations54
MICROELECTRONICS & COMPUTER
6 patentsUS5403784AApr 4, 1995
Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
MICROELECTRONICS & COMPUTER73 citations96
US5344795ASep 6, 1994
Method for encapsulating an integrated circuit using a removable heatsink support block
MICROELECTRONICS & COMPUTER99 citations96
US5049979ASep 17, 1991
Combined flat capacitor and tab integrated circuit chip and method
MICROELECTRONICS & COMPUTER68 citations96
US5309321AMay 3, 1994
Thermally conductive screen mesh for encapsulated integrated circuit packages
MICROELECTRONICS & COMPUTER37 citations92
US5265321ANov 30, 1993
Integrated circuit structure with heat exchanger elements secured thereto and method of making
MICROELECTRONICS & COMPUTER32 citations92
US5383269AJan 24, 1995
Method of making three dimensional integrated circuit interconnect module
MICROELECTRONICS & COMPUTER30 citations86