Inventor
PULIGANDLA VISWANADHAM
US9 patents
⚠️ This page may combine multiple inventors who share the name “PULIGANDLA VISWANADHAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
7 patentsUS6236115B1May 22, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM342 citations98
US6187678B1Feb 13, 2001
High density integrated circuit packaging with chip stacking and via interconnections
IBM274 citations98
US6002177ADec 14, 1999
High density integrated circuit packaging with chip stacking and via interconnections
IBM408 citations98
US5543585AAug 6, 1996
Direct chip attachment (DCA) with electrically conductive adhesives
IBM103 citations96
US5747101AMay 5, 1998
Direct chip attachment (DCA) with electrically conductive adhesives
IBM72 citations95
US4427448AJan 24, 1984
Corrosion inhibiting compositions for metals
IBM4 citations57
US4473602ASep 25, 1984
Palladium activation of 2.5% silicon iron prior to electroless nickel plating
IBM3 citations55