Inventor
LIGHT DAVID N
US22 patents
⚠️ This page may combine multiple inventors who share the name “LIGHT DAVID N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS5574630ANov 12, 1996
Laminated electronic package including a power/ground assembly
IBM189 citations98
US5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US5620782AApr 15, 1997
Method of fabricating a flex laminate package
IBM59 citations95
US5384690AJan 24, 1995
Flex laminate package for a parallel processor
IBM61 citations95
US5509196AApr 23, 1996
Method of fabricating a flex laminate package
IBM24 citations91
US4479852AOct 30, 1984
Method for determination of concentration of organic additive in plating bath
IBM51 citations91
US4725339AFeb 16, 1988
Method for monitoring metal ion concentrations in plating baths
IBM50 citations89
US6734368B1May 11, 2004
Metal backed printed circuit board assemblies
IBM13 citations84
US4490219ADec 25, 1984
Method of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrate
IBM26 citations82
US4457986AJul 3, 1984
Use of underpotential deposited layers of metals on foreign metal substrates as catalysts for electrolytic cells
IBM24 citations81
US5035778AJul 30, 1991
Regeneration of spent ferric chloride etchants
IBM9 citations71
US4540473ASep 10, 1985
Copper plating bath having increased plating rate, and method
IBM10 citations68
US4910049AMar 20, 1990
Conditioning a dielectric substrate for plating thereon
IBM4 citations61
US5221420AJun 22, 1993
Etching method for increased circuitized line width and uniformity
IBM4 citations58
IDEX ASA
6 patentsUS10776600B2Sep 15, 2020
Electronic sensor supported on rigid substrate
IDEX ASA2 citations71
US10331934B2Jun 25, 2019
Electronic sensor supported on rigid substrate
IDEX ASA2 citations71
US10687424B2Jun 16, 2020
Configurable, encapsulated sensor module and method for making same
IDEX ASA2 citations68
US10713461B2Jul 14, 2020
Double sided sensor module suitable for integration into electronic devices
IDEX ASA1 citations62
US10675791B2Jun 9, 2020
Method of manufacturing a cover member suitable for a fingerprint sensor
IDEX ASA0 citations50
US10387707B2Aug 20, 2019
Reinforcement panel for fingerprint sensor cover
IDEX ASA0 citations49