Inventor
OHKAWA MAKOTO
JP10 patents
⚠️ This page may combine multiple inventors who share the name “OHKAWA MAKOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
6 patentsUS6645045B2Nov 11, 2003
Method of measuring thickness of a semiconductor layer and method of manufacturing a semiconductor substrate
DENSO CORP57 citations95
US6279585B1Aug 28, 2001
Etching method and method for manufacturing semiconductor device using the same
DENSO CORP40 citations92
US6809034B2Oct 26, 2004
Method of etching metallic thin film on thin film resistor
DENSO CORP9 citations72
US6656755B1Dec 2, 2003
Method for manufacturing semiconductor device by polishing
DENSO CORP11 citations72
US6645875B2Nov 11, 2003
Method of processing metal and method of manufacturing semiconductor device using the metal
DENSO CORP3 citations62
US7199026B2Apr 3, 2007
Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same
DENSO CORP4 citations61
NIPPON DENSO CO
4 patentsUS5625218AApr 29, 1997
Semiconductor device equipped with a heat-fusible thin film resistor and production method thereof
NIPPON DENSO CO28 citations92
US5525831AJun 11, 1996
Semiconductor device with thin film resistor having reduced film thickness sensitivity during trimming process
NIPPON DENSO CO33 citations91
US5989970ANov 23, 1999
Method for fabricating semiconductor device having thin-film resistor
NIPPON DENSO CO16 citations73
US4829029AMay 9, 1989
Low temperature sintering ceramic material composition and process for producing the low temperature sintering ceramic
NIPPON DENSO CO5 citations62